Multi-Physics Domain-Coupling Analysis for 3D IC and Chiplet
PhyBolt provides a complete power and thermal coupling solution for chip integration and packaging, with its built-in solvers capable of simulating electron conducting behaviors accurately. PhyBolt supports user-defined parameters settings, and provides optimized input set based on accuracy requirements and computing capacity. Embedded with a pool of thermal models, PhyBolt supports different formats of CAD files and GDS files inputs.
PhyBolt equips with Signoff accuracy power computing modes, allowing seamless integration with power-thermal simulation. Its power computing adjusts to on-chip thermal levels to improve simulation accuracy. PhyBolt’s power-thermal conductivity models allow users to quickly assess chips’ power-thermal conditions under different voltage, frequency and process corners.