From November 18th to 20th, 2024, China International Semiconductor Expo (IC China) was grandly held at the National Convention Center in Beijing. Adhering to the philosophy of "Gathering Industry-Wide Resources • Facilitating Major Industrial Cooperation," IC China focuses on the semiconductor industry's supply chain and its large-scale application markets.It comprehensively demonstrates the development trend and technological innovation of the semiconductor industry, and promotes the communication and cooperation among the industry.

As a leading company in the field of EDA sign-off, Phlexing took part in this prestigious event that gathered elites from the global semiconductor industry. We showcased our latest technologies and products and shared our insights and solutions for the era of high-computing-power chips with industry peers.

The rapid development of AI technology in the era of large models has put forward higher requirements for chip design. Dr. Qing He, CEO of Phlexing, pointed out at the forum that with the continuous growth of applications such as high-performance computing, artificial intelligence, and data centers, which require efficient performance and high computational power, EDA is currently facing significant technical challenges.

In response to these challenges, Phlexing provides comprehensive EDA sign-off solutions. Our full suite of sign-off products supports 3DIC design by providing parasitic extraction, power analysis, thermal management, and lifecycle reliability analysis, ensuring the correctness of 3DIC designs and significantly improving sign-off efficiency. This robust support helps customers address the complex advanced process effects, power consumption and performance requirements.

In the future, Phlexing will work hand-in-hand with partners to explore new opportunities in the era of high-computing-power chips and drive innovation in the semiconductor industry!