Hangzhou Phlexing Technology Co., Ltd. ("Phlexing") is grounded in advanced-process Signoff and builds the τ-Aware tool infrastructure. Anchored in the first-principles physics of the time constant τ = RC and powered by its self-developed integrated Signoff platform, Phlexing moves signoff capability upstream into the entire design flow, putting DTCO (design-technology co-optimization) into practice. It systematically resolves signoff challenges spanning timing, parasitic extraction, electro-thermal coupling, power integrity, and reliability—helping chips achieve PPA co-optimization and driving a paradigm shift in chip design from experience-driven to data-driven.

Headquartered in Hangzhou, Zhejiang, Phlexing has established five R&D centers in Shanghai, Chengdu, Beijing, Xiamen, and Shenzhen, forming a nationwide R&D and technical-service network. The core team, led by returned scientists, averages over 20 years of industry experience in EDA and high-end chip design.

Phlexing has established deep strategic partnerships with multiple global top-tier chip design companies and foundries. Facing the post-Moore era, we will continue to take independent innovation as our engine, join hands with industry-chain partners to build the domestic EDA ecosystem, and inject core momentum into the high-quality development of China's semiconductor industry.