Automated partitioning for parallel computing, improving the extraction efficiency for super large-scale designs.
Multi-Corner Parallel Extraction (MCPE) achieves full-chip level speedy extraction, saving over 35% of extraction time.
Virtual Metal Fill function. Users do not need to actually complete metal fills, but still can manage concerns about metal fill’s effects on parasitic capacitance and timing in the PEX stage, greatly reducing users’ iteration and optimization time of design.
Offer technology modeling of complex geometric structures and different physical effects. Support technology modeling of complex device structures and parasitic parameters in advanced nodes.
Deeply cooperative with Phlexing’s field solvers - GloryPolaris, and GloryEX3D. Applicable with the close-looped verification of foundry’s process design kit (PDK). Renders reliable data from silicon data to device-level parasitic parameters modeling/ metal interconnect modeling to characterization of foundation IP to full-chip parasitic parameters extraction.
Smooth and efficient integration with GloryBolt (EM/IR), PhyBolt(Thermal) and GloryWatt(Power) in Phlexing’s Signoff platform, offering a one-stop Signoff solution.
GloryEX
Chip-Level RC Parasitic Extraction Tool
Overview
GloryEX, Phlexing’s chip-level RC parasitic extraction tool, provides high-performance extraction solutions for diverse design scenarios including digital, analog, SoC and etc. Its precision level meets the criteria of Signoff flow. In SoC design, GloryEX performs Gate-level RC extraction for over-100-million instance large-scale integrated circuits. GloryEX’s flow seamlessly integrates with major digital back-end flows and cooperates in a perfect way with other Phlexing’s Signoff tools, including EM/IR, Timing, Power and etc. Together, GloryEX and other Phlexing’s tools offer an all-inclusive Signoff solution. In analog design application, GloryEX can take in LVS data from third-party tools as input. Combined with calculation engine in GloryEX3D, GloryEX conducts high-precision modeling of transistor structures of advanced process nodes to perform highly precise transistor-level parasitic extraction. All extraction results can be loaded into third-party layout platforms to help users manage the design flow in an easy way.
Aiming at different process nodes, GloryEX has timely and accurately adopted modeling for different process effects including optical proximity correction (OPC), chemical mechanical processing (CMP), low-k damage, double/multiple patterning and etc. GloryEX’s calculation precision has received verification from top foundries and has been proved by multiple Tape-Outs.
Highlights
Demonstration
Products
GloryEXChip-Level RC Parasitic Extraction Tool
GloryEX3DDevice-Level High-Efficiency Parasitic Field Solver
GloryPolarisHigh-Precision 3D Modeling Tool for Parasitic Parameters
GloryBoltFull-Chip Power Grid/Signal Line EM/IR Signoff Tool
PhyBoltMulti-Physics Domain-Coupling Analysis for 3D IC and Chiplet
GloryWattFull-chip Power Signoff Tool
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