From September 25th to 27th, 2024, the "4th China lC Design Innovation Conferenceand lC Application Expo (ICDIA 2024)" was held at the Wuxi Taihu Expo Center. ICDIA 2024 was held under the theme of "Innovative Applications, Building a New Eco " , sharing the innovation achievements, hot directions, latest technologies, industrial progress and future applications in the field of integrated circuits.

In this exhibition, Phlexing attracted the attention of many visitors with its excellent technical strength and innovation ability. Dr. Qing He, CEO of Phlexing ,delivered a speech titled "From Design to Sign-off: Challenges and EDA Solutions in the Era of High Performance Computing Chips" in the main forum. Through market analysis and industry outlook, he discussed in depth the challenges of designing and verifying high-performance computing chips and the corresponding EDA solutions. He mentioned that in the era of big models, only technological innovation can meet the increasingly complex computing needs and energy efficiency requirements. Phlexing is committed to developing industry-leading sign-off tool chain, establishing ecosystems and industrial alliances with customers upstream and downstream of the industry chain, and promoting the vigorous development of the semiconductor industry.

As the top event in China's IC design industry and electronic technology, ICDIA is committed  to promoting the development of chips, IC components to system applications, and showcasing the innovation achievements and technological progress of "Chinese Chip." On the third day of the conference, ICDIA held a roundtable forum with the themeof "Opportunities and Challenges of AI Chips in the Era of Large Models." The forum was hosted by Li Lei, a researcher from Nanjing Institute of Intelligent Technology, Chinese Academy of Sciences, and discussed in depththe opportunities and challenges of Large-scale model enabled AI chips. Dr. Qing He, CEO of Phlexing, shared unique insights with industry peers on several trend topics such as "Application Scenarios for Realizing AI Enablement" and "The Path to Breaking Through for China's AI High-Performance Computing Chips."

ICDIA is not only a platform to display the latest technology and products, but also an important occasion tp promote industry exchange and cooperation. Through this exhibition, Phlexing not only demonstrated its strong capabilities in the field of EDA tools but also provided valuable insights and suggestions for the industry's development. In the future, Phlexing will continue to commit to technological innovation, enhance its core competitiveness, and meet the challenges and opportunities of the era of high-performance computing chips.