Songjiang, Shanghai, July 19, 2024 - Phlexing was invited to deliver a keynote speech titled "The Rise of Integrated Chip Industry: Design + EDA + Advanced Packaging" at the chip conference hosted by the China Computer Federation (CCF). 

The theme of the CCF Chip 2024 conference is "Developing Core Technology, Computing the Future with Intelligence," focusing on chip technology in the era of intelligence. It revolves around hot topics such as trends in chip design and EDA under the current development of the chip industry, new architectural systems, fault-tolerant computing applications, emerging computer engineering and processes, gathering top scientists, scholars, and industry experts from across the country to discuss and share the latest research achievements and development trends in their respective fields.

During the conference, Sheng Han, representing Phlexing, conducted an in-depth analysis of the latest advancements and future trends in packaging and design. He pointed out that with the continuous growth in demand for high performance and high efficiency computing power in applications such as high-performance computing, artificial intelligence, and data centers, single-chip system solutions have encountered severe technical challenges in various aspects including design, implementation, and reliability. The 3D heterogeneous integration 3DIC Chiplet design, through multi-chip integration stacking in both horizontal and vertical directions, achieves the best balance among many factors such as chip system performance, power consumption, yield, cost, and market. Phlexing’s GloryEX, GloryBolt, and PhyBolt series of sign-off products provide parasitic parameter extraction for 3DIC, power/thermal management, and full lifecycle reliability analysis for 3DIC chips, ensuring not only the correctness of 3DIC designs but also greatly improving sign-off efficiency.

This conference is not only a platform for academic exchange but also an opportunity to showcase innovative results and promote cooperation. Phlexing's presentation received widespread attention from attendees, and we engaged in in-depth exchanges and discussions with experts and scholars from various fields. We thank CCF Chip 2024 for providing Phlexing with the opportunity to speak, and we sincerely welcome colleagues, companies, and schools from the industry to contact Phlexing to try our sign-off EDA tools and offer valuable opinions and suggestions.