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EDA Enterprise Phlexing landed over 100 Million RMB Series-B Round Venture Capital to Speed up Signoff Solution R&D
News

2022-02-18

Phlexing, a leading EDA enterprise, recently announced its Series-B round financing of over 100 million RMB. This round of financing is led by China Fortune-Tech Capital, followed by HUA Capital and other institutions. The funds will be allocated to accelerate the development and refinement of the advanced process tools solutions, and to recruit more talents in the EDA industry.


As an EDA enterprise with high standards and global competitiveness, Phlexing specializes in the field of Signoff and verification of chip physical design. We provide a broad, industry-leading product portfolio, including parasitic extraction, power integrity, electromigration, IR drop, reliability and multi-physical domain, to deal with the growing challenges of chip design.


In 2021, Phlexing has achieved fruitful results: GloryEX high accuracy full-chip parasitic extraction Solution based on advanced processes, was verified and delivered to top IC design enterprise; also, we have become the youngest EDA company among Samsung's global partners. GloryEX has successfully passed the high standard certification of Samsung advanced processes, the only Signoff accuracy extraction tool passing that certification in China. In addition, Phlexing has accomplished breakthroughs in the development of GloryBolt full-chip power and reliability Signoff solution, PhyBolt multi-physics solver for 3D IC chips, and other new products. As above, Phlexing Signoff tool solution is forming a functional platform. Integrating multiple industry resources, Phlexing continues to grow with broader customers recognition. Phlexing devotes to providing more comprehensive EDA solutions integrated with both tool products and platform system.


Shaojin Chen, Managing Director of China Fortune-Tech Capital: "Phlexing has accumulated rich industry experience. The core team members have been engaged in the R&D of EDA and chip products for a long time. They have led the most advanced EDA development process, and have a deep understanding of the industry system. Phlexing has launched a series of internationally competitive EDA products in the field of digital back-end Signoff domain, with parameters fitting the industry Golden standard, and has cooperation with top IC design houses and foundries. Phlexing team has the most advanced EDA core engine and international vision. We firmly believe that Phlexing can continue to efficiently launch competitive new products, to facilitate the rapid development of the domestic semiconductor industry."


Huajun Yang, founding partner of HUA Capital: "The development of semiconductor chip industry is an important indicator to evaluate the level of national information-technology level. The chip industry chain contains many links, and EDA is known as the "Pearl in the Crown" in the chip industry. Compared to Europe and the United States, China's development in EDA is still very primitive. Nevertheless, Phlexing has seized the opportunity of EDA, established a young and dynamic team, created highly competitive products, and become a rising star in the field. HUA Capital is committed to value investment and industry empowerment, and envisions to grow together with Phlexing. We believe that in the near future, Phlexing will become an outstanding force in the EDA field and make important contributions to the development of China's chip industry."


Dr. Qing He, Chairman and General Manager of Phlexing: "We are much honored to be recognized by China Fortune-Tech Capital, HUA Capital and other investors. As a core high-tech enterprise driven by technological innovation, Phlexing is committed to creating the EDA software cornerstone supporting the development of semiconductor industry. In the post-Moore era, advanced process nodes will face more challenges. As a bridge between IC design companies and foundries, Phlexing will always hold the mission of 'Stride with Phlexing to empower the development of the semiconductor industry', incorporate the momentum of capitals, talents and industrial resources, create a complete EDA Signoff tool solution based on advanced processes, and help enhance the core competitiveness of semiconductor industry."


China Fortune-Tech Capital

China Fortune-Tech Capital Co., Ltd. (China Fortune-Tech Capital) was founded by leading enterprises in the China domestic IC industry, a senior investment team, and other shareholders. China Fortune-Tech Capital focuses on the relevant fields of the IC industry, invests in high-quality enterprises in materials, design, equipment, IP and service, and provides valuable services for the invested enterprises.


HUA Capital

Founded in 2015 by former Huawei executives and senior investors, HUA Capital focuses on investing in information technology and industry transformation driven by information technology, and is committed to fostering leaders in the technology industry through value investment and empowerment. HUA Capital is deeply engaged in the information technology industry. It focuses on investment opportunities in semiconductor, intelligent terminal, cloud computing (IaaS, PaaS) and enterprise services (SaaS, AI, BigData, B2B). At present, HUA Capital has invested in a number of rising enterprises in sub-fields, such as Innoscience,Joywell Semiconductor, Volta Semiconductor, Silicon Integrated, Vertilite, Changjing ELEC TECH, EpicMEMS, GalaxyCore, Flagchip as Flagship, Len Technology, Jaguar Micro, VISINEX Technology, DERA, Kerma Tek, VISOL, Phlexing, Jingwei HIRAIN, Hanshow, LDROBOT, Cloudbase, SmartX, PPIO, XForcePlus, Cloud Account, CloudCare, Casstime and ICHUNT.


Phlexing

Phlexing Technology Co., Ltd. (Phlexing) has a world-class EDA team and innovative technologies. As an EDA enterprise with completely independent intellectual property rights and international competitiveness, Phlexing is committed to providing the leading Signoff tool solutions that facilitate collaboration and innovation in IC design and manufacturing. Phlexing EDA tools are widely applied in the global IC industry, helping customers realize best power consumption, performance and area (PPA) with groundbreaking Signoff technology. 

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