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About Phlexing

Anchored in Advanced-Node Signoff
Empowering a τ-Aware EDA Framework

Phlexing Technology Co., Ltd. ("Phlexing") is a core driver of the τ-Aware design paradigm for the post-Moore era and a provider of full-stack Signoff solutions. Focused on the Signoff stage at advanced process nodes, the company builds upon its self-developed integrated platform to deliver end-to-end capabilities spanning parasitic extraction, timing signoff, power integrity, electro-thermal coupling, and reliability verification. By practicing the Shift Left methodology across the full design flow and implementing DTCO (Design-Technology Co-Optimization), Phlexing systematically resolves critical Signoff challenges, driving the paradigm shift from experience-driven to data-driven chip design and enabling customers to achieve holistic PPA optimization.


Headquartered in Hangzhou, Zhejiang, Phlexing has established five R&D centers in Shanghai, Chengdu, Beijing, Xiamen, and Shenzhen, forming a nationwide R&D and technical-service network. The core team, led by returned scientists, averages over 20 years of industry experience in EDA and high-end chip design.


Phlexing has established deep strategic partnerships with multiple global top-tier chip design companies and foundries. Facing the post-Moore era, we will continue to take independent innovation as our engine, join hands with industry-chain partners to build the domestic EDA ecosystem, and inject core momentum into the high-quality development of China's semiconductor industry.

Phlexing Technology Co., Ltd. ("Phlexing") is a core driver of the τ-Aware design paradigm for the post-Moore era and a provider of full-stack Signoff solutions. Focused on the Signoff stage at advanced process nodes, the company builds upon its self-developed integrated platform to deliver end-to-end capabilities spanning parasitic extraction, timing signoff, power integrity, electro-thermal coupling, and reliability verification. By practicing the Shift Left methodology across the full design flow and implementing DTCO (Design-Technology Co-Optimization), Phlexing systematically resolves critical Signoff challenges, driving the paradigm shift from experience-driven to data-driven chip design and enabling customers to achieve holistic PPA optimization.


Headquartered in Hangzhou, Zhejiang, Phlexing has established five R&D centers in Shanghai, Chengdu, Beijing, Xiamen, and Shenzhen, forming a nationwide R&D and technical-service network. The core team, led by returned scientists, averages over 20 years of industry experience in EDA and high-end chip design.


Phlexing has established deep strategic partnerships with multiple global top-tier chip design companies and foundries. Facing the post-Moore era, we will continue to take independent innovation as our engine, join hands with industry-chain partners to build the domestic EDA ecosystem, and inject core momentum into the high-quality development of China's semiconductor industry.

Milestones

2018

  • Phlexing founded in Hangzhou

2019

  • Released GloryBolt
  • Became the EDA supplier of China's No.1 chip company
  • Established the Shanghai R&D Center

2020

  • Released GloryEX
  • Established strategic cooperation with a global top-3 foundry

2021

  • Recognized as a National High-Tech Enterprise
  • Certified by Samsung for advanced processes

2022

  • Released PhyBolt
  • Led a national-level major project
  • Named a Zhejiang Provincial Leading Innovation and Entrepreneurship Team
  • Established the Chengdu and Beijing R&D Centers

2023

  • Released the full signoff flow
  • Supported tape-outs on high-end processes
  • Established the Xiamen and Shenzhen R&D Centers

2024

  • Released GloryEX3D and GloryPolaris

2025

  • Released GloryEye
  • Supported domestic 3DIC tape-outs
  • Recognized as a National Key "Little Giant" Enterprise

2026

  • Released GloryGrid and GloryET
  • Launched the τ-Aware tool framework
  • Awarded First Prize of the Zhejiang Provincial Science and Technology Progress Award
  • Recognized as a National Key Software Enterprise

2018
2019
2020
2021
2022
2023
2024
2025
2026

Honors & Qualifications

2022 China IC Design Achievement Award

2023 Hangzhou Quasi-Unicorn Enterprise of the Year

2023 China IC Design Achievement Award

2024 Gazelle Enterprise of the Year

2024 Hangzhou "Baige" Enterprise of the Year

2024 Quasi-Unicorn Enterprise of the Year

2025 Hangzhou Quasi-Unicorn Enterprise of the Year

National Key Software Enterprise

World Semiconductor Conference — IC Design Pioneer Enterprise

Zhejiang Science & Technology Rising Star

First Prize, Zhejiang Provincial Science and Technology Progress Award

Zhejiang Intellectual Property Award Second Prize for Invention Patent

Zhejiang Intellectual Property Award Second Prize for Computer Software

Zhejiang Province Specialized, Refined, Distinctive & Novel SME

"Zhexin Qixing" Award

Specialized, Refined, Distinctive & Novel "Little Giant" Enterprise

2021 Industrial Software Innovation Application Competition Industrial Software Innovation Award

2024 First-Release Domestic Software of the Year

2025 2nd "China Chip" EDA Special Award

China Electronics News Domestic EDA Tool Word-of-Mouth Ranking

Anchored in Advanced-Node Signoff
Empowering a τ-Aware EDA Framework