As chip design enters the post-Moore era, the time constant τ serves as the unified metric. Anchored in production-proven Signoff, Phlexing moves signoff-level accuracy upstream into the entire design flow, building the τ-Aware tool framework.
With independent innovation as the core driving force, we are building an intelligent EDA capability system for next-generation chip design.
Delivering a unified, high-accuracy, high-efficiency full-chip EDA toolchain that empowers the world's leading chip design companies.
Anchored at τ = RC, Phlexing builds the τ-Aware tool framework spanning four layers—planning, extraction, analysis, and closure—delivering integrated Signoff for advanced processes and 3DIC.
From foundry process R&D to chip design signoff, the τ-Aware tool framework
covers the full-chain electrical signoff needs.
• Delivers full-chip RC parasitic extraction, power-integrity and electromigration signoff, and static timing analysis signoff... • Tailored to the electrical signoff demands of AI training and inference chips, high-performance CPU / GPU designs, and advanced-node designs at 5nm, 3nm, GAA, and beyond.
• Delivers parasitic extraction and modeling for arbitrary stacking configurations, power-integrity and electromigration signoff, and power-thermal coupled multi-physics analysis… • Tailored to the electrical signoff demands of GPU and AI high-performance 3D-stacked chips, multi-process / multi-fab heterogeneous SoCs, and HBM high-bandwidth memory stacks.
• Delivers full-chip RC parasitic extraction, power-integrity and electromigration signoff, and static timing analysis signoff... • Tailored to the electrical signoff demands of AI training and inference chips, high-performance CPU / GPU designs, and advanced-node designs at 5nm, 3nm, GAA, and beyond.
Phlexing Technology Co., Ltd. ("Phlexing") is a core driver of the τ-Aware design paradigm for the post-Moore era and a provider of full-stack Signoff solutions. Focused on the Signoff stage at advanced process nodes, the company builds upon its self-developed integrated platform to deliver end-to-end capabilities spanning parasitic extraction, timing signoff, power integrity, electro-thermal coupling, and reliability verification. By practicing the Shift Left methodology across the full design flow and implementing DTCO (Design-Technology Co-Optimization), Phlexing systematically resolves critical Signoff challenges, driving the paradigm shift from experience-driven to data-driven chip design and enabling customers to achieve holistic PPA optimization.
Get product evaluations, flow integration, and technical support—begin an engineering collaboration for the advanced-process era.