On November 30th,Tsinghua University's PhD team of 2024 Innovation Leadership Engineering visited Hangzhou Phlexing Technology Co., Ltd. for research, where both parties conducted in-depth exchange on the development trend of semiconductor industry, market environment for EDA companies,and cooperation between universitiesand enterprises.

At the beginning of the visit, Dr. Qing He, the CEO of Phlexing, warmly welcomed the visiting team and introduced in detail the company's entrepreneurial journey, corporate culture, team composition, and overall situation, which fully demonstrating Phlexing's values of innovation,enterprise and collaboration.

Afterwards, Phlexing's marketing and sales representatives introduced to the visiting team the current product layout, application areas, ecosystem construction, and university-enterprise cooperation,etc. Phlexing has completely realized independent research and development, completely got rid of the dependence on overseas technology. It focuses on physical design sign-off for SoC, ASIC, Memory, Custom, AMS, and other chips, deeply develops unique capabilities in software algorithms and chip design, continuously enriches the product line, and creates a full-flow EDA Sign-off. Phlexing's Glory Sign-off platform and a series of Sign-off EDA tool chain products have been recognized by several top 10 semiconductor companies both domestically and internationally, leading to strategic cooperation.

From company overview to industry trends, from product technology to future layout, Phlexing comprehensively demonstrated the innovative strength of a cutting-edge technology enterprise.

The Tsinghua University Innovative Leading Engineering Doctoral team expressed that this exchange not only allowed everyone to gain a deeper understanding of Phlexing's contributions in the semiconductor field, but also provided valuable experience and new ideas for future academic research and in-depth cooperation.

Phlexing welcomes every collision of wisdom with an open attitude and leads the development of the industry with the power of innovation. In the future, we look forward to in-depth exchanges with more universities to jointly open a new chapter in the EDA industry!