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    • Advanced-Node Full-Chip Electrical Signoff

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    HomeApplicationsAdvanced-Node Full-Chip Electrical Signoff

    Full-Chip Electrical Signoff Solution for Advanced Nodes

    As process nodes advance into the 5nm, 3nm, and even GAA (Gate-All-Around) era, the complexity of POCV/AOCV variation modeling escalates dramatically, multi-corner and multi-scenario combinations explode, and timing margins are compressed to picoseconds. RC extraction, timing analysis, power analysis, and power integrity each requires manual script conversion, driving up iteration costs. Built on RC parasitic parameter extraction, Phlexing covers the full flow of timing, power, power integrity, and electro-thermal coupling, delivering a full-chip electrical signoff solution from parasitic extraction to ECO convergence.

    Core Highlights

    • Unified High-Accuracy Modeling

      Industry-first unified modeling for planar and 3D device structures, with validation at the 3D device, transistor, and gate levels.

    • Ultra-Capacity Support

      A scalable computing architecture supports ultra-large designs with hundreds of millions of transistors and billions of gates, meeting the demands of today's high-end digital logic chips.

    • High-Performance Architecture

      Distributed Machine Processing delivers linear speedup with added compute resources. Physical Partition ensures correct matrix-solving boundary conditions, boosting performance while preserving accuracy.

    • Flexible ECO Convergence

      Equipped with a three-tier progressive-accuracy model — Logic Only, Total RC, and SPEF — enabling users to flexibly trade off verification efficiency against result accuracy.

    • Unified Signoff Data Foundation

      Native end-to-end data flow across RC extraction, timing, power, power integrity, electro-thermal coupling, and ECO convergence eliminates cross-tool format conversion overhead and significantly improves iteration efficiency.

    Key Features

    01

    Full-Chip RC Parasitic Parameter Extraction
    Natively supports accurate FinFET and GAA device modeling and complex multi-layer metal routing scenarios; MCPE (Multi-Corner Parallel Extraction) improves extraction efficiency by over 35%. Built-in VMF accurately predicts parasitic capacitance impact from metal fill.

    02

    Power Integrity & Electromigration Signoff
    Supports Static/Dynamic IR Drop and full-mode PG/Signal EM verification; GPL-based cell current waveforms improve Dynamic IR analysis accuracy. Grid Check runs 30× faster than conventional algorithms.

    03

    Static Timing Analysis Signoff
    Supports POCV, AOCV, and LVF variation-aware modeling with built-in GBA/PBA dual analysis modes and hierarchical HyperScale analysis flow. Supports IR-drop and temperature-field back-annotation of cell and interconnect delay, accurately capturing multiphysics-coupled timing characteristics at advanced nodes.

    04

    Power Signoff
    Accurately calculates dynamic and static power; supports multi-voltage-domain and multi-clock-domain power modeling. A built-in toggle-probability propagation algorithm enables RTL-waveform-based power estimation with error within 3%.

    05

    Power-Thermal Coupling Analysis
    Steady-state/transient thermal simulation with bidirectional power iteration; leveraging model-order-reduction technology transient temperature prediction error below 1°C. Enables integrated Thermal-Aware EM analysis, providing accurate temperature distribution for EM signoff.

    06

    Signoff Closure & Physical ECO
    Equipped with a three-tier progressive-accuracy model — Logic Only, Total RC, and SPEF — supporting MMMC multi-scenario parallel repair across Metal, Clock, and IR ECO types. With deep physical-layout integration, it achieves full-flow physical-level incremental ECO repair.

    Applications

    AI Training / AI Inference Chips
    Full-chip signoff at hundreds of millions of transistors, billions of gates, and ultra-high density.
    High-Performance CPU/GPU Chips
    Complex multi-core, multi-voltage-domain scenarios with POCV/AOCV variation-aware timing convergence and ECO optimization.
    5nm/3nm/GAA Advanced-Node IC Design
    Process-variation sensitivity analysis, FinFET/GAA device accurate modeling, and signoff-level accuracy validation.
    AI Training / AI Inference Chips
    Full-chip signoff at hundreds of millions of transistors, billions of gates, and ultra-high density.
    High-Performance CPU/GPU Chips
    Complex multi-core, multi-voltage-domain scenarios with POCV/AOCV variation-aware timing convergence and ECO optimization.
    5nm/3nm/GAA Advanced-Node IC Design
    Process-variation sensitivity analysis, FinFET/GAA device accurate modeling, and signoff-level accuracy validation.

    Related Products

    GloryEX®

    Full-Chip RC Parasitic Extraction Tool
    GloryEX3D®

    Device-Level High-Efficiency Parasitic Field Solver
    GloryPolaris®

    High-Precision 3D Parasitic Modeling Tool
    GloryEye®

    Full-Chip Static Timing Analysis Tool
    GloryBolt®

    Full-Chip Power Grid and Signal EMIR Signoff Tool
    PhyBolt®

    Chip-Level Multi-Physics Analysis Tool
    GloryWatt®

    Full-Chip Power Signoff Tool
    GloryGrid®

    Early Power-Grid Assessment and Optimization Tool
    GloryET®

    Signoff-Closure ECO Tool

    Anchored in Advanced-Node Signoff
    Empowering a τ-Aware EDA Framework

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